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Detection even when holes or openings are present
A challenge in this area is the reliable detection of circuit boards with different colors, surfaces, and equipment. Thanks to their extra large light spot, the special sensor solutions from Leuze electronic function very reliably even where other sensors fail due to holes or openings. An additional advantage is the problem-free maintenance of the systems.
From wafer to chip
Before separating the individual chips, the rear side of the wafer is worn down by polishing or cauterizing until the final thickness is attained. Then the individual chips are sawed apart. Sawing and grinding are two of the critical processes for achieving a high yield, and they must be completely controlled, monitored and safeguarded with sensors.
To the right circuit with the right mask
The so-called front end in the production of integrated circuits deals with the manufacture of electrically live construction elements such as transistors, capacitors, etc. under clean room conditions. 2D-code readers from Leuze electronic are used here, e.g. for decoding masks labeled with IDs from the mask SMIF pod (Standard Mechanical InterFace), which are needed for the exposure of the circuits.
Precise work in every aspect
Absolute precision is required for the production of semiconductor wafers in clean rooms. Automated processes reduce the probability of errors and enable consistent product quality of the extremely thin wafers. These processes are controlled and monitored with our sensors and, for example, the wafers in the FOUP are correctly detected. In addition, these systems reliably detect notches/flat areas on the wafer edge, what is necessary for centering.
From individual parts to a functioning product
After the circuit boards are equipped, they are mounted to other components to make finished products. During the final mounting process, automatic tests are performed to ensure and monitor that all circuit boards and mechanical attachments are present and in the correct position. Excellent sensor solutions from Leuze electronic, such as the smart camera, can be used for these quality inspections.
Efficiently equipping circuit boards
When equipping circuit boards with electronic components, our sensors are confronted with many different challenges. These include highly diverse, sometimes strongly reflective surfaces, very small components and high cycle rates. For these tasks, Leuze electronic offers an extensive selection of product solutions for all types of applications as well as expansive practical application know-how.
|2D-code detection||Circuit board manufacturing||Bar code, 2D-code|
|Circuit board alignment and testing||Circuit board manufacturing||Orientation detection, Positioning|
|Detection of the circuit boards||Circuit board manufacturing||Presence inspection, Positioning|
|Double feed detection||Circuit board manufacturing||Dimension, contour, volume|
|Drill break detection||Circuit board manufacturing||Machine protection / collision prevention|
|Positioning and alignment markings||Circuit board manufacturing||Orientation detection, Positioning, Dimension, contour, volume|
|Circuit board position detection||Final mounting||Presence inspection, Positioning|
|Detection of the circuit boards||Final mounting||Presence inspection, Positioning|
|Operational safety||Final mounting||Point of operation guarding|
|Pallet ID||Final mounting||RFID, 2D-code|
|2D-code on IC chip||Semiconductor back end processes||Bar code, 2D-code|
|IC testing / character detection on IC chip||Semiconductor back end processes||Quality control|
|Module management||Semiconductor back end processes||RFID, Bar code, 2D-code|
|Operational safety||Semiconductor back end processes||Point of operation guarding|
|2D-code on wafers||Semiconductor front end processes||Bar code, 2D-code|
|Handling of masks||Semiconductor front end processes||RFID, Bar code, 2D-code|
|Operational safety||Semiconductor front end processes||Point of operation guarding|
|Planarity / position measurement of the wafer gripper||Semiconductor front end processes||Distance|
|Wafer centering||Semiconductor front end processes||Presence inspection, Positioning|
|Wafer detection||Semiconductor front end processes||Presence inspection, Positioning|
|Wafer slip out||Semiconductor front end processes||Machine protection / collision prevention|
|Operational safety||Semiconductor wafer production||Point of operation guarding|
|Wafer centering||Semiconductor wafer production||Presence inspection, Positioning|
|2D-code detection||Surface mounting of components||Bar code, 2D-code|
|Component testing||Surface mounting of components||Quality control, Dimension, contour, volume|
|Detection of the circuit boards||Surface mounting of components||Presence inspection, Positioning|
|Feeder management||Surface mounting of components||RFID, Bar code, 2D-code|
|Height measurement for IC chip||Surface mounting of components||Distance|
|Height measurement for dosing heads||Surface mounting of components||Distance|
|Operational safety||Surface mounting of components||Point of operation guarding|
|Positioning and alignment markings||Surface mounting of components||Orientation detection, Positioning, Dimension, contour, volume|